Reliability and Yield Problems of Wire Bonding in Microelectronics: The...
83
Price: $10.13
Product Description
Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science by George Harman Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less
Binding: Hardcover
Publication Year: 1989
Weight: 0 lbs
Product Group: Book
IsTextBook: Yes
ISBN: 9780930815257
Format: Hardcover
Language: English
Book Title: Reliability and Yield Problems of Wire Bonding in Microelectronics : The Application of Materials and Interface Science
Illustrator: Yes
Author: George G. Harman
Publisher: International Society for Hybrid Micro Electronics
Genre: Technology & Engineering
Topic: Industrial Design / Packaging, Electronics / Semiconductors
Number of Pages: Xiii, 202 Pages
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